PVD – Physical Vapour Deposition

PVD – Physical Vapour Deposition – is a technology used for the deposition of thin metal films on different types of substrates. The process takes place under vacuum, where the metals to be deposited are evaporated. The metal ions, due to their kinetic energy and the difference of potential applied to the piece to be coated, are attracted to the surface of the objects, where they condense and form the desired coating. The metal film is obtained through a physical process and, consequently, has superior characteristics compared to any other chemical or electrochemical treatment.

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